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TSMC will spend up to $ 15 billion on the development of 3-nm technology
fifteen.01.2021 [10:30],
Alexey Razin

TSMC’s quarterly reporting event revealed that capital expenditures will reach a record $ 25 billion this year, according to the most conservative estimates. More than half of this amount will be directed to the development of 3-nm technology, its pilot production will be launched this year, and mass production – in the second half of the next.

Image source: TSMC

Representatives of TSMC did not comment on rumors typical for Taiwanese media about the possibility of a delay in the development of 3-nm technology at yesterday’s reporting event, but in their wording they indicated the period of the start of mass production of 3-nm products more vaguely: “the third quarter” gave way to the “second half” 2022 year.

According to official data, about $ 20 billion of TSMC’s capital expenditures this year will be directed to the development of all advanced lithographic technologies, of this amount, $ 15 billion, according to rumors, will fall on 3-nm technology. When the conference guests asked the company representatives whether the decision to increase costs to a record amount was related to the need to expand production for Intel’s needs, TSMC employees avoided a direct answer, but explained that costs are growing due to the increasing complexity of lithographic technologies.

The first samples of 3nm products will appear this year, and mass production will be launched in the second half of next. Compared to the 5nm process technology, the new technology will increase the density of placement of logic elements on a chip by 70%, as well as increase their switching speed by 15%, or reduce power consumption by 30%. The decision to keep the familiar structure of FinFET transistors within the 3-nm process technology will reduce the risks in its development and reduce the cost.

According to TSMC representatives, the new technical process will allow the company to attract more customers in the direction of components for high-performance computing, and everything will not be limited to the smartphone segment. From next year, TSMC will also expand its business of assembling and testing products with complex spatial arrangements. The first customers in this area will be developers of high-performance components.