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Power outages of two UMC enterprises harmed chip production
UMC has four factories that process silicon wafers with a size of 300 mm, but six of the seven factories specializing in a size of 200 mm are located in the Taiwanese city of Hsinchu. A power outage has damaged the production of some of the products on two of them.
Image source: UMC
This was reported by Bloomberg with reference to the comments of the UMC CFO. The company will have to discuss with customers the issue of compensation for the cost of rejected products, but preliminary data indicate that the damage will be insignificant. Representatives of the company refused to discuss whether the interests of automakers, which receive from UMC profile components produced from silicon wafers of 200 mm standard size, are affected.
At present, the power supply of UMC enterprises affected by the power failure is gradually being restored. The Taiwanese media have recently been actively discussing changes in the pricing policy of UMC, which was forced to raise the cost of its services both in the direction of 200-mm plates and in the direction of 300-mm plates. Demand currently exceeds supply, and capacity utilization is close to maximum.